Purdue Forms Partnership for Semiconductor Design Center June 29, 2022 Purdue University’s College of Engineering is partnering with MediaTek Inc., a leading global fabless chipmaker, to open the Midwest’s first semiconductor chip design center, to be housed on Purdue’s campus.
The Time is Now: Sustainability in Industrial Additive Manufacturing May 25, 2022 While it may be greener than traditional manufacturing, AM remains a powerful contributor to emissions, power consumption and supply chain volume.
Ceramics Expo to Take Place in Late August July 15, 2022 The seventh edition of Ceramics Expo will take place on Aug. 30-31, 2022 at the Huntington Convention Center of Cleveland.
Workforce Engineering—How to Solve the Skills Gap March 8, 2022 The best way to solve the skills gap is to ignite the already existing and yet dormant fuel of curiosity inside of young minds.
Free Cybersecurity Health Assessments for Michigan Manufacturers October 20, 2023 Elevate your cybersecurity preparedness with a free SensCy Score assessment.
Micross Components Awarded $134.3 Million DOD Contract November 27, 2023 The Department of Defense has awarded Micross Components $134.3 million under the IBAS Cornerstone RESHAPE program.
Intel Gets $8.5 Billion for Chip Plants March 20, 2024 The money will go toward building new and beefing up existing sites in the U.S.
Processing Advanced Materials: Vacuum Curing and Debulking October 4, 2023 By improving efficiency, reducing labor costs, and enhancing product quality, vacuum tables offer aerospace manufacturers a competitive edge in the production of composite parts and adhesive-bonded structures.
Leveraging CAM for Ultrasonic Knife Cutting October 3, 2023 Revolutionizing aerospace manufacturing: a discussion of ultrasonic knife cutting and innovative cam software for precise machining of advanced materials.
Friends in Fusion October 30, 2023 Reflections from one-half of the team who brought us selective laser sintering (SLS)
