Hexagon, Raytheon Developing Simulation Tool November 3, 2022 Hexagon and Raytheon Technologies have partnered to deliver a simulation tool that will enable evaluation and optimisation of metal additive manufacturing (AM) processes through the prediction of thermal history and defects at the laser path and powder layer scale.
Manufacturing Simulation Helps Prepare RPI Students for Real-World Challenges October 28, 2022 An interview with Sam Chiappone, director of manufacturing innovation, Rensselaer Polytechnic Institute School of Engineering.
Tying It All Together October 12, 2022 Achieving robust software integration is a crucial first step toward weaving a strong, effective, and productive digital thread.
Pensacola is Attracting and Growing Smart Manufacturing Technology Businesses February 15, 2023 Pensacola is home to world-class innovation and smart manufacturing technology businesses in wind energy, robotics, life science, chemicals, aviation and more.
Nurturing a High-Quality AM Community February 7, 2023 Additive manufacturing front and center at 2023 events
Datanomix, Hexagon Announce Partnership January 23, 2023 Datanomix and Hexagon announced a partnership to offer the Datanomix software solution to its global manufacturing customers.
The State of Smart June 2, 2022 Pandemic moves digitization to front burner; software enables connection to legacy equipment.
Creating the Biofabrication Workforce of the Future June 3, 2022 BioFabUSA is advancing workforce development programs that inspire people to tackle the challenges of manufacturing replacement human cells, tissues and organs.
Advanced CAM Increases Productivity in Directed Energy Deposition Processes July 13, 2022 Directed energy deposition methods depend on CAM and computers
Purdue Forms Partnership for Semiconductor Design Center June 29, 2022 Purdue University’s College of Engineering is partnering with MediaTek Inc., a leading global fabless chipmaker, to open the Midwest’s first semiconductor chip design center, to be housed on Purdue’s campus.