Processing Advanced Materials: Vacuum Curing and Debulking October 4, 2023 By improving efficiency, reducing labor costs, and enhancing product quality, vacuum tables offer aerospace manufacturers a competitive edge in the production of composite parts and adhesive-bonded structures.
Cobots and Simulation Software for Non-Destructive Evaluation September 26, 2023 NASA's Langley Research Center is using collaborative robots (cobots) and RoboDK software to automate and enhance the inspection of aircraft fuselages. By utilizing dual cobots, heating elements, and infrared cameras, NASA has significantly improved inspection speed, accuracy, and coverage.
Leveraging CAM for Ultrasonic Knife Cutting October 3, 2023 Revolutionizing aerospace manufacturing: a discussion of ultrasonic knife cutting and innovative cam software for precise machining of advanced materials.
ABB Robotics Unveils OptiFact Software Platform September 26, 2023 ABB Robotics introduces OptiFact, a powerful software platform revolutionizing data collection and analysis in automated factories.
Ideagen Enters Agreement to Acquire DevonWay to Strengthen High-Risk Industry Services Portfolio September 28, 2023 Ideagen to bolster high-risk industry solutions with DevonWay acquisition.
FABTECH 2023: A Gathering of Industry Leaders, Innovators and Experts September 20, 2023 Unlocking the Future of Manufacturing: Key Insights from FABTECH 2023
U.S. Government Awards GlobalFoundries New $3.1 Billion, 10-Year Contract for Secure Chip Manufacturing September 21, 2023 GlobalFoundries Secures $3.1 Billion 10-Year DoD Contract for Cutting-Edge Semiconductor Manufacturing, Bolstering National Security and Innovation.
Simplifying the Daily Grind July 7, 2023 Advanced software tools and data analytics are helping streamline grinding processes.
Advanced CAM Increases Productivity in Directed Energy Deposition Processes July 13, 2022 Directed energy deposition methods depend on CAM and computers
Purdue Forms Partnership for Semiconductor Design Center June 29, 2022 Purdue University’s College of Engineering is partnering with MediaTek Inc., a leading global fabless chipmaker, to open the Midwest’s first semiconductor chip design center, to be housed on Purdue’s campus.