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Vollmer of America Slates Open House for October

Vollmer of America has announced an Open House Celebration for its new facility in Findlay Township, Pa., scheduled for Oct. 22-23. Vollmer broke ground on May 11, 2019 at the new site, near Pittsburgh International Airport.

Structured Vision in Manufacturing

Structured light systems measure surfaces by projecting a pattern of fringes, then using cameras and sophisticated software to convert them into point clouds of metrology data. Accuracy can reach the single-digit microns over millions of points.

United Grinding Hosts Worldwide Audience at Grinding Symposium 2019

The Grinding Symposium 2019 hosted by the United Grinding Group attracted hundreds of journalists, customers, and other stakeholders from around the world. Held near its Studer subsidiary’s plant in Thun, Switzerland, the scenery of the Alps and a warm welcome was combined with a purpose: education.

Today’s Grinders Must Do It All for HMLV Production

When it comes to the production of high-precision parts for industries ranging from aerospace to medical, grinding remains the best, most cost-effective approach to obtaining fine surface finishes and tight tolerances.

Manufacturing and AI: Promises and Pitfalls

We all know the buzzwords circulating around digital data and the factory. You have heard them—Industry 4.0, smart factories, data analytics, and artificial intelligence (AI). The question we all have is how will this impact workers in the long term? What do these terms really mean? Nevertheless, both traditional software suppliers and makers of advanced manufacturing equipment are offering digital solutions.

The Science of Diffusion Bonding or Joining together Dissimilar Metals

Metal diffusion bonding is an essential joining method for achieving a high-purity interface when two similar metals require superior structural integrity. The process involves applying high temperature, and pressure to metals mated together in a hot press causes the atoms on solid metallic surfaces to intersperse and bond.