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Micro Manufacturing Keeps Shrinking the Envelope

Micro components continue to shrink in size, demanding ever-greater precision and improved handling of parts with sub-micron-sized features. New approaches in micro machining technology include higher-precision systems from traditional micro machining developers, as well as techniques using additive manufacturing processes and semiconductor wafer-scale technology on the smallest of micro parts.

Auto Industry Faces Short- and Long-Term Challenges

Sales of cars and light trucks plummeted during the Great Recession and General Motors Co. and Chrysler emerged from government-back bankruptcies in 2009. Since then, total industry deliveries have surged, hitting a record 17.47 million in 2015, according to Autodata Corp.

New Graphene Synthesized for Industrial Uses

Materials researcher Metalysis Ltd. (South Yorkshire, UK) recently announced that it has developed a new synthesized graphene material that holds potential for future industrial production. Metalysis, which is focused on commercializing its proprietary electrochemical metal-powder manufacturing technology, said its R&D successfully produced graphene using the company’s own process.

Renishaw Inc. Moves to New Headquarters

Renishaw Inc. is preparing to move into a new 133,000-sq.-ft. office and warehouse facility in West Dundee, IL, about 40 miles from Chicago. The two-story facility will be the company’s new North American headquarters, but also includes space for product development, testing, warehousing and distribution. It includes the new U.S. Additive Manufacturing Solutions Center – part of Renishaw’s network of global Solutions Centers, opening over the next year.

Materials Trek

Additive veteran Andrew Graves boldly goes where no materials expert has gone before.

Experts knock down AI barriers

Why don’t more manufacturers in the United States use smart manufacturing technologies like AI and machine learning to reduce waste, achieve predictive maintenance and enhance their automation systems? Five CESMII roundtable panelists share their insights.