Japanese, German Innovators Broaden Work That Stars ‘Digital Companion’ March 20, 2017 In preparation for mass customization, for starters, Japanese and German tech research officials today committed to expanding their joint work to establish a “social-technical or maybe ‘cyber-social’ environment where ‘digital companions’ and production lines communicate with humans” working in manufacturing, Andreas Dengel said in an interview with Smart Manufacturing magazine here at the CeBIT (Centrum der Büroautomation und Informationstechnologie und Telekommunikation) fair.
Siemens Introduces Camstar Electronics Suite Software January 30, 2019 Siemens announced today the introduction of Camstar™ Electronics Suite software, an innovative manufacturing execution system (MES) for electronics.
Intel Gets $8.5 Billion for Chip Plants March 20, 2024 The money will go toward building new and beefing up existing sites in the U.S.
New Mega-Supplier Targets Green Solutions August 18, 2023 The Faurecia-Hella merger has birthed Forvia, a forward-looking automotive powerhouse pioneering electrification, energy management, sustainable materials, and cutting-edge cockpit and lighting innovations.
Processing Advanced Materials: Vacuum Curing and Debulking October 4, 2023 By improving efficiency, reducing labor costs, and enhancing product quality, vacuum tables offer aerospace manufacturers a competitive edge in the production of composite parts and adhesive-bonded structures.
Biden Administration Allocates $15.5B to Boost Electric Vehicle Transition and Revitalize Auto Manufacturing Industry August 31, 2023 President Biden's $15.5 billion investment drives a clean energy revolution, revitalizing auto manufacturing and accelerating the electric vehicle transition.
President Biden Visits Manufacturing Facility where Enphase Produces its First U.S.-Made Microinverters July 7, 2023 The President announced $60 million in capital investment from Enphase Energy Inc.
Micross Components Awarded $134.3 Million DOD Contract November 27, 2023 The Department of Defense has awarded Micross Components $134.3 million under the IBAS Cornerstone RESHAPE program.
Additive Electronics: Next-Gen Semiconductor Packaging June 9, 2023 Ultimately, the best way to improve semiconductor packaging may be to eliminate the traditional package altogether.
