Cold Sintering Process Saves Energy, Material October 18, 2017 Researchers at Penn State University (University Park, PA) have devised a novel method for sintering, a widely used manufacturing process for powdered materials. The new process, which uses much less time and energy than current approaches, could have global implications on manufacturing and energy savings and pave the way for new discoveries.
Kyocera to Build New R&D Center December 21, 2020 Kyocera Corp. said it will begin construction of a new research and development center in January 2021 at its Kokubu campus in Kirishima City, Kagoshima, Japan.
Renishaw Announces Expanded CMM Software Offering with New Verisurf Agreement in North America November 10, 2021 Renishaw has entered into an agreement with Verisurf Software Inc., allowing companies in North America to access Verisurf coordinate measuring machine software from Renishaw.
Smart Metrology, Smart Choice June 13, 2022 Digital metrology enables faster measurements, saving time, money and convenience.
Building resilience against disruption December 2, 2021 Key steps are virtual twins and real relationships.
H.C. Starck aiming high with refractory metals December 3, 2021 A conversation with Faith Oehlerking, R&D engineer for additive Manufacturing at H.C. Starck Solutions.
Easy Setups with Automated On-Machine Probing December 7, 2021 Machine operators can replace time-consuming manual setups and gauging with the precision of digital metrology through a conversational CNC interface.
Industry 4.0: The Print Edition April 13, 2022 What manufacturers wanting in on Industry 4.0 should know before investing in a 3D printer
Deep Knowledge; Broad Applications April 12, 2022 The work of SME Additive Community members encompasses the entire history of the technology as well as its most novel applications.
Consider Fire Requirements When Specifying Composites December 30, 2021 With the use of composites in demanding applications increasing, improving knowledge of their fire performance is becoming a safety-critical issue, particularly for building and transportation applications.