Kyocera to Build New R&D Center December 21, 2020 Kyocera Corp. said it will begin construction of a new research and development center in January 2021 at its Kokubu campus in Kirishima City, Kagoshima, Japan.
Desktop Metal, Uniformity Labs Announce Breakthrough March 11, 2021 Desktop Metal Inc. and Uniformity Labs, today announced a breakthrough powder that enables aluminum sintering for binder jetting AM technology.
Breakthrough Water-Soluble 3D Printing Material Introduced November 3, 2020 Infinite Material Solutions LLC announced the launch of a water-soluble 3D printing support material called AquaSys® 180.
The Press Shop of the Future Starts Today March 2, 2023 Schuler North America showcased its Digital Suite product family for the Press Shop of the Future during the grand opening of its new service facility in Canton, Mich.
Aiming to Improve, Enhance Firearms Marking March 8, 2022 Laser marking is fast, flexible, repeatable, durable and it’s a one-button operation.
Beyond Crypto, Tech & Tourism, Miami is a Manufacturing Hub April 18, 2022 When SOP Technologies sought the ideal destination to develop, test, manufacture, and market its devices that help stop ocean pollution, Miami quickly rose high on the list.
Smart Biomanufacturing February 4, 2022 Developing better biosensors is one of the hurdles to be surmounted in order to bring tissue manufacturing to scale.
Welcome to Voices AMplified January 31, 2022 The true story of AM—it’s current and potential abilities and the people who continue to develop it—deserves to be heard.
New President and CEO Named at TRUMPF Inc. February 2, 2022 Lutz Labisch to Become President and CEO for TRUMPF in North America
The Science of Diffusion Bonding or Joining together Dissimilar Metals January 3, 2022 Metal diffusion bonding is an essential joining method for achieving a high-purity interface when two similar metals require superior structural integrity. The process involves applying high temperature, and pressure to metals mated together in a hot press causes the atoms on solid metallic surfaces to intersperse and bond.