Displaying 1-10 of 1114 results for

IMCO Carbide Tool has launched a new series of endmills for extreme tool paths in aluminum alloys and provide superior surface finishes in aerospace industry applications.

The increased use of CT scanning for metal powder bed fusion parts is usually associated with high-value parts and elevated quality requirements. There are increased requests for CT scanning on parts made of engineering-grade polymers like PEEK, PEKK or ULTEM and for fiber-reinforced composites like Nylon 12 CF.

The industry’s fastest growing firms are leveraging new artificial intelligence (AI), blockchain and Internet of Things (IoT) solutions to transform supply chains, transport and logistics. Reliance on paper forms and clashing systems are giving way to improved transparency across the value chain.

Machine shops use a variety of techniques to track the condition of their cutting tools, ranging from simple to sophisticated. No matter what monitoring method is used, it can be crucial in preventing catastrophic tool failure. At its best, monitoring also significantly boosts tool life and slashes tooling costs.

The evolution to high speed machining (HSM) is continuing and toolholders are playing a crucial role in that process, which includes the interlinking of machining center, programming, high-speed spindles, advanced cutting tools, balancing, and high-performance toolholders in order for shops to take full advantage of HSM.

Workholding needs to be super-sized when machining workpieces like truck transmission housings, wind turbine blades, rocket bodies, and more, for industries like aerospace and defense, agricultural, energy, marine, rail, and on- and off-road transportation.

GE and the Global Manufacturing and Industrialisation Summit (GMIS) have announced a partnership to explore the role of digitization, lean manufacturing, and workplace safety to support the transformation of manufacturing and economic regeneration.

Shifts in microchip-making to aid automotive, medical

Integrate lasers onto PICs? Use silicon to make PICs? Co-package optics with electronics? This institute is tackling it all.

Properly balancing one's tools can pay big dividends.