Sponsored by the Direct Digital Manufacturing Tech Group, part of SME’s Additive Manufacturing Community

University of Waterloo

Team Members:
Gitanjali Shanbhag
Lisa Brock

Advisor:
Dr. Mihaela Vlasea

Winning Design: The Copper Cooler: Heat Sink for CPUs

The University of Waterloo team investigated the redesign of a heat sink for cooling central processing units (CPUs). The new heat sink features an organic, branched fin design revolved around a circular base which is situated on top of the CPU. It will be part of an assembly with a fan mounted above the heat sink to facilitate forced convection, making it an active heat sink system. 

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University of Waterloo

Team Members:
Alexander Martinez-Marchese
Sagar Patel
Pablo Enrique

Advisor:
Mihaela Vlasea

Co-Runner Up Design: Topology Optimized Wind Turbine Blades Using Sustainable Biomaterials

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The Ohio State University

Team Members:
Alark Choudhary
Isaac Flemming
Hitansh Singhal
Sujith Srinivaas

Advisor:
Dr. Allen Yi

Co-Runner Up: Customized Phone Case Designed For Thermal Efficiency

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